PCB Manufacturing Process – A Complete Guide

A PCB is used to attach electronic mechanisms electrically. Conductive pathways are created specifically for circuit connections by engraving trails from copper sheet plastic-coated onto a non-conductive substrate.

A PCB contains a leading layer that is made up of reedy copper foil. The cloistering layer dielectric is plastic-coated together with “epoxy resin PREPREG”.

According to the reviews of China PCB manufacturer, one of the most commonly used PCB type is FR-4. Boards can be single sided or double sided.

Dual sided PCB can be utilized to attach electronic modules on both the sides through-hole plating.

PCB China manufacturers
All of this is done by copper plating the walls of each hole so as to connect the conductive layers of the PCB.

Pros of PCB over Bread-board:

• You can get a much-advanced density board with PCB.
• PCB design is more dependable than the one made on a breadboard.
• Obviously, the circuit looks neat without any wires popped up and not falling apart.
• You can have exact control over the circuit component you are using, and you can contentedly fit in oddly shaped mechanisms that are hard to fix on a breadboard. One of the best examples of it is security camera PCBA.
• For the manufacturing of a large number of PCBs, the price lessens down and the fusing can be done by fully automated apparatuses.

For PCB fabrication, there are a few basic steps that need to be followed systematically.

The detailed description is not provided, but steps are mentioned below for your kind consideration on how to make.

You must online read blogs and reviews to gather more information on PCB manufacturing.

PCB manufacturing process

Here is the step by step PCB manufacturing steps for you, read them and follow them one-by-one:

Step 1: Design and Output
Step 2: From File to Film
Step 3: Printing the Inner layers with copper metal
Step 4: Removing the Unwanted Copper
Step 5: Layer Alignment and Optical Inspection
Step 6: Layer-up and Bond
Step 7: Drill
Step 8: Plating and Copper Deposition
Step 9: Outer Layer Imaging
Step 10: Plating
Step 11: Final Etching
Step 12: Solder Mask Application
Step 13: Surface Finish
Step 14: Silkscreen
Step 15: Electrical Test
Step 16: Profiling and V-Scoring